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Heat dissipation details in power adapter design

source:Industry News     Popular:adapter     release time:2022-01-12 09:09:15     Article author:sznbone    

  Heat dissipation details in power adapter design(图1)

  We know that if the temperature of any electronic product is too high, it will cause function failure, serious or even damage. The same is true for power adapters, so do you know the heat dissipation details in the design of power adapters? Let's follow the power adapter manufacturers to learn about it!

  1. The choice of radiator.

  The principle of radiator selection is to choose a small and light radiator as far as possible under the premise of ensuring sufficient heat dissipation, so as to save space in the machine and reduce the total weight of the power adapter.

  2. The installation of the radiator.

  When installing the radiator, try to choose the installation method with low heat dissipation and thermal resistance.

  3. Minimize the interface thermal resistance as much as possible.

  The surface of the radiator should be smooth and clean. In order to reduce the contact thermal resistance between the radiator and the power semiconductor, care should be taken to keep the interface between the two smooth and clean. If the interface is smooth and clean, and there is no oxide layer, there is no need to add a gasket in between, otherwise it should be coated with silicone grease or a thermal pad should be installed.

  4. Coating of the radiator.

  In order to increase the radiation capacity of the radiator, the surface of the radiator should be coated with a high emissivity coating such as black paint or oxide. The radiator with a black coating should be preferred, and the coating should be protected from damage.

  5. The installation of the radiator.

  When installing a power device on the heat sink, the size of the mounting hole should match the size of the power semiconductor fixing hole, and the hole should not be too large or too small.

  6. The installation location of power semiconductors.

  The power semiconductor should be installed in the center of the heat sink. If multiple power semiconductors are installed on the same heat sink, the heat sink can be divided into several parts according to the proportion of semiconductor power consumption, and each semiconductor is placed in the center of the corresponding part as much as possible, so that the heat sink can be evenly heated. Improve heat dissipation efficiency.

  7. The location of the radiator.

  The radiator should be in direct contact with the air flow outside the power supply as much as possible to reduce the ambient temperature. At the same time, the convection heat exchange effect of the radiator can be improved.


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